Image capturing module for saving focusing time and increasing assembly flatness and method of assembling the same

ABSTRACT

An image capturing module for saving focusing time and increasing assembly flatness and a method of assembling the same are disclosed. The image sensing chip has a first horizontal top surface, the optical filter has a second horizontal top surface, and the first horizontal top surface and second horizontal top surface are obtained by a horizontal correction system using a laser light source. The distance from the second horizontal top surface to the first horizontal top surface is defined as a predetermined fixed focusing distance. Whereby, the movable lens assembly is directly disposed on the second horizontal top surface to save the focusing time of the movable lens assembly relative to the image sensing chip, and the first horizontal top surface and the second horizontal top surface are horizontal to each other for increasing the assembly flatness of the movable lens assembly relative to the image sensing chip.

BACKGROUND OF THE INVENTION

1. Field of the Invention

The instant disclosure relates to an image capturing module and a methodof assembling the same, and more particularly to an image capturingmodule for saving focusing time and increasing assembly flatness and amethod of assembling the same.

2. Description of Related Art

Recently, it has become more and more popular for portable devices suchas mobile phones or PDA to be equipped with an imaging module.Furthermore, since the market requires these portable devices to havemore powerful functions and smaller sizes, it is necessary for theimaging module to generate high quality pictures and to be of smallsize. One improvement of picture quality is to increase the number ofpixels. The pixel number of an imaging module has already increased fromthe VGA-level 30 pixels to 2, 3 or even 8 million pixels, which is nowcommon in the market. Another improvement lies in the definition of theimage. Thus, the imaging module of a portable device also develops froma fixed-focus mode to auto-focus mode or even optical zoom mode.

The auto-focus mode employs the principle of moving the lens in theimaging module suitably according to various distances of targets,whereby the optical image of the desired target is focused correctly onan image sensor to generate a clear image. The common ways of activatingthe lens to move in the imaging module include activating by a steppingmotor, piezoelectric motor and voice coil motor (VCM). However, whenboth the image sensor and the sensor housing are disposed on the samestacked datum plane of the circuit board, the assembly tilt angle of thesensor housing relative to the image sensor would be increased, thus theimage quality provided by the imaging module cannot be improved due tothe increased assembly tilt angle. Besides, it is very time consuming tomanually focus the imaging module relative to the image sensor.

SUMMARY OF THE INVENTION

One aspect of the instant disclosure relates to an image capturingmodule for saving focusing time and increasing assembly flatness and amethod of assembling the same.

One of the embodiments of the instant disclosure provides an imagecapturing module for saving focusing time and increasing assemblyflatness, comprising: an image sensing unit, a housing frame, anactuator structure and an optical filter. The image sensing unitincludes a carrier substrate and an image sensing chip disposed on thecarrier substrate and electrically connected to the carrier substrate,wherein the image sensing chip has a first horizontal top surface on thetop side thereof, and the first horizontal top surface is obtained by ahorizontal correction system using a laser light source. The housingframe is disposed on the carrier substrate to surround the image sensingchip. The actuator structure is disposed on the housing frame and abovethe image sensing chip, wherein the actuator structure includes a lensholder disposed on the housing frame and a movable lens assemblydisposed inside the lens holder and above the image sensing chip, thelens holder includes a surrounding movable member movably disposedtherein, the movable lens assembly is fixed inside the surroundingmovable member through at least two separate bonding glue, and themovable lens assembly is movably disposed inside the lens holder throughthe surrounding movable member. The optical filter is disposed on thehousing frame and between the image sensing chip and the movable lensassembly, wherein the optical filter has a second horizontal top surfaceon the top side thereof, and the second horizontal top surface isobtained by the horizontal correction system using the laser lightsource, and the distance from the second horizontal top surface of theoptical filter to the first horizontal top surface of the image sensingchip is defined as a predetermined fixed focusing distance. Whereby, themovable lens assembly is directly disposed on the second horizontal topsurface of the optical filter to save the focusing time of the movablelens assembly relative to the image sensing chip, and the firsthorizontal top surface of the image sensing chip and the secondhorizontal top surface of the optical filter are horizontal to eachother for increasing the assembly flatness of the movable lens assemblyrelative to the image sensing chip.

Another one of the embodiments of the instant disclosure provides animage capturing module for saving focusing time and increasing assemblyflatness, comprising: an image sensing unit, a housing frame, anactuator structure and an optical filter. The image sensing unitincludes a carrier substrate and an image sensing chip disposed on thecarrier substrate and electrically connected to the carrier substrate,wherein the image sensing chip has a first horizontal top surface on thetop side thereof. The housing frame is disposed on the carrier substrateto surround the image sensing chip. The actuator structure is disposedon the housing frame and above the image sensing chip, wherein theactuator structure includes a lens holder disposed on the housing frameand a movable lens assembly movably disposed inside the lens holder andabove the image sensing chip. The optical filter is disposed on thehousing frame and between the image sensing chip and the movable lensassembly, wherein the optical filter has a second horizontal top surfaceon the top side thereof, and the distance from the second horizontal topsurface of the optical filter to the first horizontal top surface of theimage sensing chip is defined as a predetermined fixed focusingdistance. Whereby, the movable lens assembly is directly disposed on thesecond horizontal top surface of the optical filter to save the focusingtime of the movable lens assembly relative to the image sensing chip,and the first horizontal top surface of the image sensing chip and thesecond horizontal top surface of the optical filter are horizontal toeach other for increasing the assembly flatness of the movable lensassembly relative to the image sensing chip.

Yet another one of the embodiments of the instant disclosure provides amethod of assembling an image capturing module for saving focusing timeand increasing assembly flatness, comprising: providing an image sensingunit and a housing frame, wherein the image sensing unit includes acarrier substrate and an image sensing chip disposed on the carriersubstrate and electrically connected to the carrier substrate, and thehousing frame is disposed on the carrier substrate to surround the imagesensing chip; obtaining a first horizontal top surface on the top sideof the image sensing chip by a horizontal correction system using alaser light source; placing an optical filter on the housing frame andabove the image sensing chip; obtaining a second horizontal top surfaceon the top side of the optical filter by the horizontal correctionsystem using the laser light source, wherein the distance from thesecond horizontal top surface of the optical filter to the firsthorizontal top surface of the image sensing chip is defined as apredetermined fixed focusing distance; providing an actuator structuredisposed on the housing frame and above the image sensing chip, whereinthe actuator structure includes a lens holder disposed on the housingframe and a movable lens assembly disposed inside the lens holder andabove the image sensing chip, and the lens holder includes a surroundingmovable member movably disposed therein, wherein the movable lensassembly is directly disposed on the second horizontal top surface ofthe optical filter to save the focusing time of the movable lensassembly relative to the image sensing chip, and the first horizontaltop surface of the image sensing chip and the second horizontal topsurface of the optical filter are horizontal to each other forincreasing the assembly flatness of the movable lens assembly relativeto the image sensing chip; and then fixing the movable lens assemblyinside the surrounding movable member through at least two separatebonding glue, wherein the movable lens assembly is movably disposedinside the lens holder through the surrounding movable member.

Therefore, the first horizontal top surface on the top side of the imagesensing chip and the second horizontal top surface on the top side ofthe optical filter can be obtained by the horizontal correction systemusing the same laser light source, thus when the second horizontal topsurface of the optical filter is horizontal to the first horizontal topsurface of the image sensing chip, the assembly tilt angle of themovable lens assembly relative to the image sensing chip can be reducedfor ensuring the flatness of the movable lens assembly relative to theimage sensing chip. More precisely, when the distance from the secondhorizontal top surface of the optical filter to the first horizontal topsurface of the image sensing chip is defined as a predetermined fixedfocusing distance in advance, the movable lens assembly can be directlydisposed on the second horizontal top surface of the optical filter tocut down the focusing time of the movable lens assembly relative to theimage sensing chip.

To further understand the techniques, means and effects of the instantdisclosure applied for achieving the prescribed objectives, thefollowing detailed descriptions and appended drawings are herebyreferred to, such that, and through which, the purposes, features andaspects of the instant disclosure can be thoroughly and concretelyappreciated. However, the appended drawings are provided solely forreference and illustration, without any intention to limit the instantdisclosure.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 shows a flowchart of the method of assembling an image capturingmodule for saving focusing time and increasing assembly flatnessaccording to the instant disclosure;

FIG. 2 shows a lateral, cross-sectional, schematic view of the assemblysteps S100 and S102 of the method of assembling an image capturingmodule for saving focusing time and increasing assembly flatnessaccording to the instant disclosure;

FIG. 3 shows a lateral, cross-sectional, schematic view of the assemblysteps S104 and S106 of the method of assembling an image capturingmodule for saving focusing time and increasing assembly flatnessaccording to the instant disclosure; and

FIG. 4 shows a lateral, cross-sectional, schematic view of the assemblysteps S108 and S110 of the method of assembling an image capturingmodule for saving focusing time and increasing assembly flatnessaccording to the instant disclosure.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

The embodiments of “an image capturing module for saving focusing timeand increasing assembly flatness and a method of assembling the same” ofthe instant disclosure are described. Other advantages and objectives ofthe instant disclosure can be easily understood by one skilled in theart from the disclosure. The instant disclosure can be applied indifferent embodiments. Various modifications and variations can be madeto various details in the description for different applications withoutdeparting from the scope of the instant disclosure. The drawings of theinstant disclosure are provided only for simple illustrations, but arenot drawn to scale and do not reflect the actual relative dimensions.The following embodiments are provided to describe in detail the conceptof the instant disclosure, and are not intended to limit the scopethereof in any way.

Referring to FIG. 1 to FIG. 4, the instant disclosure provides a methodof assembling an image capturing module M for saving focusing time andincreasing assembly flatness, comprising the following steps:

First, the step S100 is that: referring to FIG. 1 and FIG. 2, providingan image sensing unit 1 and a housing frame 2, wherein the image sensingunit 1 includes a carrier substrate 10 (or a carrying substrate) and animage sensing chip 11 disposed on the carrier substrate 10 andelectrically connected to the carrier substrate 10, and the housingframe 2 is disposed on the carrier substrate 10 to surround the imagesensing chip 11. For example, the image sensing chip 11 may be a CMOS(Complementary Metal-Oxide-Semiconductor) sensor, and the image sensingchip 11 can be adhesively disposed on the carrier substrate 10 throughany type of adhesive material (not labeled) such as UV adhesive glue,thermosetting glue or curing glue applied to oven etc. Moreover, thehousing frame 2 can be adhesively disposed on the carrier substrate 10through any type of adhesive material (not labeled) such as UV adhesiveglue, thermosetting glue or curing glue applied to oven etc. Inaddition, the carrier substrate 10 may be a circuit substrate having aplurality of conductive pads (not labeled) disposed on the top surfaceof the circuit substrate, and the image sensing chip 11 has a pluralityof conductive pads (not labeled) disposed on the top surface of theimage sensing chip 11. Each conductive pad (not labeled) of the imagesensing chip 11 can be electrically connected to the correspondingconductive pad (not labeled) of the carrier substrate 10 through acorresponding conductive wire (not labeled), thus the image sensing chip11 can be electrically connected with the carrier substrate 10 throughthe conductive wires (not labeled).

Next, the step S102 is that: referring to FIG. 1 and FIG. 2, obtaining afirst horizontal top surface 110 on the top side of the image sensingchip 11 by a horizontal correction system using a laser light source S.More precisely, the laser light source S is disposed at a predeterminedposition P (such as a fixing position) above the image sensing chip 11to generate a first laser light beam L1 that is directly and verticallyprojected onto the first horizontal top surface 110 of the image sensingchip 11, and the first laser light beam L1 generated by the laser lightsource S is reflected by the first horizontal top surface 110 of theimage sensing chip 11 to form a first reflecting light beam R1 that isdirectly and vertically projected onto the predetermined position P orvery close to the predetermined position P. In other words, when the topside of the image sensing chip 11 is adjusted to become a firsthorizontal top surface 110, the first laser light beam L1 can bereflected by the first horizontal top surface 110 to form the firstreflecting light beam R1 that vertically returns to the predeterminedposition P, or the first reflecting light beam R1 is very close to thepredetermined position P due to the permissible error. At present, thetop side of the image sensing chip 11 is exactly the first horizontaltop surface 110 as a horizontal datum plane.

Then, the step S104 is that: referring to FIG. 1 and FIG. 3, placing anoptical filter 4 on the housing frame 2 and above the image sensing chip11. More precisely, as shown in FIG. 3, the housing frame 2 has a topopening 200 disposed on the top side thereof and right above the imagesensing chip 11, and the top opening 200 of the housing frame 2 isenclosed by the optical filter 4. For example, the optical filter 4 maybe a flat glass plate having an infrared (IR) coated layer and/or anantireflection (AR) coating layer, and the optical filter 4 can be fixedinside a concave space (not labeled) of the housing frame 2 throughfirst bonding glue (not labeled) for enclosing the top opening 200 ofthe housing frame 2.

Afterward, the step S106 is that: referring to FIG. 1 and FIG. 3,obtaining a second horizontal top surface 400 on the top side of theoptical filter 4 by the horizontal correction system using the laserlight source S, wherein the distance from the second horizontal topsurface 400 of the optical filter 4 to the first horizontal top surface110 of the image sensing chip 11 is defined as a predetermined fixedfocusing distance D. More precisely, the laser light source S (such as alaser level) is disposed at a predetermined position P above the opticalfilter 4 to generate a second laser light beam L2 that is directly andvertically projected onto the second horizontal top surface 400 of theoptical filter 4, and the second laser light beam L2 generated by thelaser light source S is reflected by the second horizontal top surface400 of the optical filter 4 to form a second reflecting light beam R2that is directly and vertically projected onto the predeterminedposition P or very close to the predetermined position P. In otherwords, when the top side of the optical filter 4 is adjusted to become asecond horizontal top surface 400, the second laser light beam L2 can bereflected by the second horizontal top surface 400 to form the secondreflecting light beam R2 that vertically returns to the predeterminedposition P, or the second reflecting light beam R2 is very close to thepredetermined position P due to the permissible error. At present, thetop side of the optical filter 4 can be formed as the second horizontaltop surface 400 that is horizontal to the first horizontal top surface110.

It is worth mentioning that the first laser light beam L1 generated bythe laser light source S also can be inclinedly projected onto the firsthorizontal top surface 110 of the image sensing chip 11, and the secondlaser light beam L2 generated by the laser light source S also can beslantwise projected onto the second horizontal top surface 400 of theoptical filter 4. When the first reflecting light beam R1 and the secondreflecting light beam R2 are projected onto the same position, the topside (such as the second horizontal top surface 400) of the opticalfilter 4 also can be horizontal to the top side (such as the firsthorizontal top surface 110) of the image sensing chip 11, thus theassembly tilt angle of the movable lens assembly 31 relative to theimage sensing chip 11 also can be reduced for ensuring the flatness ofthe movable lens assembly 31 relative to the image sensing chip 11.

Afterward, the step S108 is that: referring to FIG. 1 and FIG. 3,providing an actuator structure 3 disposed on the housing frame 2 andabove the image sensing chip 11, wherein the actuator structure 3includes a lens holder 30 disposed on the housing frame 2 and a movablelens assembly 31 disposed inside the lens holder 30 and above the imagesensing chip 11, and the lens holder 30 includes a surrounding (annular)movable member 30M movably disposed therein. In addition, the movablelens assembly 31 is directly disposed on the second horizontal topsurface 400 of the optical filter 4 to save the focusing time of themovable lens assembly 31 relative to the image sensing chip 11, and thefirst horizontal top surface 110 of the image sensing chip 11 and thesecond horizontal top surface 400 of the optical filter 4 are horizontalto each other for increasing the assembly flatness of the movable lensassembly 31 relative to the image sensing chip 11. Whereby, the firsthorizontal top surface 110 of the image sensing chip 11 and the secondhorizontal top surface 400 of the optical filter 4 are horizontal toeach other, thus when the movable lens assembly 31 is directly disposedon the second horizontal top surface 400 of the optical filter 4, notonly the assembly tilt angle of the movable lens assembly 31 relative tothe image sensing chip 11 can be reduced for ensuring the flatness ofthe movable lens assembly 31 relative to the image sensing chip 11, butalso the focusing time of the movable lens assembly 31 relative to theimage sensing chip 11 can be cut down.

More precisely, the movable lens assembly 31 has a bottom plane 310 onthe bottom side thereof for directly contacting the second horizontaltop surface 400 of the optical filter 4, and the predetermined fixedfocusing distance D from the second horizontal top surface 400 of theoptical filter 4 to the first horizontal top surface 110 of the imagesensing chip 11 is totally or substantially the same as an adjustablefocusing distance F from the bottom plane 310 of the movable lensassembly 31 to the first horizontal top surface 110 of the image sensingchip 11.

For example, the surrounding movable member 30M has an inner surroundingsurface 300 such as a threadless surface, and the movable lens assembly31 has an outer perimeter surface 311 such as a threadless surface. Inaddition, the lens holder 30 also can be adhesively disposed on thehousing frame 2 through any type of adhesive material (not labeled) suchas UV adhesive glue, thermosetting glue or curing glue applied to ovenetc., and the movable lens assembly 31 may be an optical lens group thatis composed of a plurality of optical lenses (not labeled). It is worthmentioning that, as shown in FIG. 4, the actuator structure 3 may be avoice coil motor actuator, but the voice coil motor actuator used in thefirst embodiment is merely an example and is not meant to limit theinstant disclosure. For example, the actuator structure 3 can bereplaced by an optical auxiliary structure having a fixed lens assembly.

Finally, the step S110 is that: referring to FIG. 1, FIG. 4 and FIG. 5,when the second horizontal top surface 400 of the optical filter 4 ishorizontal to the first horizontal top surface 110 of the image sensingchip 11 and the movable lens assembly 31 is directly disposed on thesecond horizontal top surface 400 of the optical filter 4, fixing themovable lens assembly 31 inside the surrounding movable member 30Mthrough at least two separate bonding glue H, wherein the movable lensassembly 31 is movably disposed inside the lens holder 30 through thesurrounding movable member 30M.

Whereby, the instant disclosure provides an image capturing module M forsaving focusing time and increasing assembly flatness via the assemblysteps from S100 to S110, and the image capturing module M includes animage sensing unit 1, a housing frame 2, an actuator structure 3 and anoptical filter 4. The image sensing chip 11 has a first horizontal topsurface 110 on the top side thereof, the optical filter 4 has a secondhorizontal top surface 400 on the top side thereof, and the firsthorizontal top surface 110 and the second horizontal top surface 400 areobtained by a horizontal correction system using a laser light source S.Therefore, the first horizontal top surface 110 of the image sensingchip 11 and the second horizontal top surface 400 of the optical filter4 are horizontal to each other, for increasing the assembly flatness ofthe movable lens assembly 31 relative to the image sensing chip 11.Hence, when the distance from the second horizontal top surface 400 ofthe optical filter 4 to the first horizontal top surface 110 of theimage sensing chip 11 is defined as a predetermined fixed focusingdistance D in advance, not only the movable lens assembly 31 can bedirectly disposed on the second horizontal top surface 400 of theoptical filter 4 to cut down the focusing time of the movable lensassembly 31 relative to the image sensing chip 11, but also the firsthorizontal top surface 110 of the image sensing chip 11 and the secondhorizontal top surface 400 of the optical filter 4 can be horizontal toeach other for increasing the assembly flatness of the movable lensassembly 31 relative to the image sensing chip 11.

In conclusion, the first horizontal top surface 110 on the top side ofthe image sensing chip 11 and the second horizontal top surface 400 onthe top side of the optical filter 4 can be obtained by the horizontalcorrection system using the same laser light source S, thus when thesecond horizontal top surface 400 of the optical filter 4 is horizontalto the first horizontal top surface 110 of the image sensing chip 11,the assembly tilt angle of the movable lens assembly 31 relative to theimage sensing chip 11 can be reduced for ensuring the flatness of themovable lens assembly 31 relative to the image sensing chip 11. Moreprecisely, when the distance from the second horizontal top surface 400of the optical filter 4 to the first horizontal top surface 110 of theimage sensing chip 11 is defined as a predetermined fixed focusingdistance D in advance, the movable lens assembly 31 can be directlydisposed on the second horizontal top surface 400 of the optical filter4 to cut down the focusing time of the movable lens assembly 31 relativeto the image sensing chip 11.

The aforementioned descriptions merely represent the preferredembodiments of the instant disclosure, without any intention to limitthe scope of the instant disclosure which is fully described only withinthe following claims. Various equivalent changes, alterations ormodifications based on the claims of the instant disclosure are all,consequently, viewed as being embraced by the scope of the instantdisclosure.

What is claimed is:
 1. An image capturing module for saving focusingtime and increasing assembly flatness, comprising: an image sensing unitincluding a carrier substrate and an image sensing chip disposed on thecarrier substrate and electrically connected to the carrier substrate,wherein the image sensing chip has a first horizontal top surface on thetop side thereof, and the first horizontal top surface is obtained by ahorizontal correction system using a laser light source; a housing framedisposed on the carrier substrate to surround the image sensing chip; anactuator structure disposed on the housing frame and above the imagesensing chip, wherein the actuator structure includes a lens holderdisposed on the housing frame and a movable lens assembly disposedinside the lens holder and above the image sensing chip, the lens holderincludes a surrounding movable member movably disposed therein, themovable lens assembly is fixed inside the surrounding movable memberthrough at least two separate bonding glue, and the movable lensassembly is movably disposed inside the lens holder through thesurrounding movable member; and an optical filter disposed on thehousing frame and between the image sensing chip and the movable lensassembly, wherein the optical filter has a second horizontal top surfaceon the top side thereof, and the second horizontal top surface isobtained by the horizontal correction system using the laser lightsource, and the distance from the second horizontal top surface of theoptical filter to the first horizontal top surface of the image sensingchip is defined as a predetermined fixed focusing distance; wherein themovable lens assembly is directly disposed on the second horizontal topsurface of the optical filter to save the focusing time of the movablelens assembly relative to the image sensing chip; wherein the firsthorizontal top surface of the image sensing chip and the secondhorizontal top surface of the optical filter are horizontal to eachother for increasing the assembly flatness of the movable lens assemblyrelative to the image sensing chip.
 2. The image capturing module ofclaim 1, wherein the housing frame has a top opening disposed on the topside thereof and between the image sensing chip and the movable lensassembly, and the top opening of the housing frame is enclosed by theoptical filter, wherein the movable lens assembly has a bottom plane onthe bottom side thereof for directly contacting the second horizontaltop surface of the optical filter, and the predetermined fixed focusingdistance from the second horizontal top surface of the optical filter tothe first horizontal top surface of the image sensing chip issubstantially the same as an adjustable focusing distance from thebottom plane of the movable lens assembly to the first horizontal topsurface of the image sensing chip, wherein the surrounding movablemember has an inner surrounding surface as a threadless surface, and themovable lens assembly has an outer perimeter surface as a threadlesssurface.
 3. The image capturing module of claim 1, wherein the laserlight source is disposed at a predetermined position above the imagesensing chip to generate a first laser light beam that is directlyprojected onto the first horizontal top surface of the image sensingchip, and the first laser light beam generated by the laser light sourceis reflected by the first horizontal top surface of the image sensingchip to form a first reflecting light beam that is directly projectedonto the predetermined position or very close to the predeterminedposition.
 4. The image capturing module of claim 1, wherein the laserlight source is disposed at a predetermined position above the opticalfilter to generate a second laser light beam that is directly projectedonto the second horizontal top surface of the optical filter, and thesecond laser light beam generated by the laser light source is reflectedby the second horizontal top surface of the optical filter to form asecond reflecting light beam that is directly projected onto thepredetermined position or very close to the predetermined position. 5.An image capturing module for saving focusing time and increasingassembly flatness, comprising: an image sensing unit including a carriersubstrate and an image sensing chip disposed on the carrier substrateand electrically connected to the carrier substrate, wherein the imagesensing chip has a first horizontal top surface on the top side thereof;a housing frame disposed on the carrier substrate to surround the imagesensing chip; an actuator structure disposed on the housing frame andabove the image sensing chip, wherein the actuator structure includes alens holder disposed on the housing frame and a movable lens assemblymovably disposed inside the lens holder and above the image sensingchip; and an optical filter disposed on the housing frame and betweenthe image sensing chip and the movable lens assembly, wherein theoptical filter has a second horizontal top surface on the top sidethereof, and the distance from the second horizontal top surface of theoptical filter to the first horizontal top surface of the image sensingchip is defined as a predetermined fixed focusing distance; wherein themovable lens assembly is directly disposed on the second horizontal topsurface of the optical filter to save the focusing time of the movablelens assembly relative to the image sensing chip; wherein the firsthorizontal top surface of the image sensing chip and the secondhorizontal top surface of the optical filter are horizontal to eachother for increasing the assembly flatness of the movable lens assemblyrelative to the image sensing chip.
 6. The image capturing module ofclaim 5, wherein the housing frame has a top opening disposed on the topside thereof and between the image sensing chip and the movable lensassembly, and the top opening of the housing frame is enclosed by theoptical filter, wherein the movable lens assembly has a bottom plane onthe bottom side thereof for directly contacting the second horizontaltop surface of the optical filter, and the predetermined fixed focusingdistance from the second horizontal top surface of the optical filter tothe first horizontal top surface of the image sensing chip issubstantially the same as an adjustable focusing distance from thebottom plane of the movable lens assembly to the first horizontal topsurface of the image sensing chip.
 7. A method of assembling an imagecapturing module for saving focusing time and increasing assemblyflatness, comprising: providing an image sensing unit and a housingframe, wherein the image sensing unit includes a carrier substrate andan image sensing chip disposed on the carrier substrate and electricallyconnected to the carrier substrate, and the housing frame is disposed onthe carrier substrate to surround the image sensing chip; obtaining afirst horizontal top surface on the top side of the image sensing chipby a horizontal correction system using a laser light source; placing anoptical filter on the housing frame and above the image sensing chip;obtaining a second horizontal top surface on the top side of the opticalfilter by the horizontal correction system using the laser light source,wherein the distance from the second horizontal top surface of theoptical filter to the first horizontal top surface of the image sensingchip is defined as a predetermined fixed focusing distance; providing anactuator structure disposed on the housing frame and above the imagesensing chip, wherein the actuator structure includes a lens holderdisposed on the housing frame and a movable lens assembly disposedinside the lens holder and above the image sensing chip, and the lensholder includes a surrounding movable member movably disposed therein,wherein the movable lens assembly is directly disposed on the secondhorizontal top surface of the optical filter to save the focusing timeof the movable lens assembly relative to the image sensing chip, and thefirst horizontal top surface of the image sensing chip and the secondhorizontal top surface of the optical filter are horizontal to eachother for increasing the assembly flatness of the movable lens assemblyrelative to the image sensing chip; and fixing the movable lens assemblyinside the surrounding movable member through at least two separatebonding glue, wherein the movable lens assembly is movably disposedinside the lens holder through the surrounding movable member.
 8. Themethod of claim 7, wherein the housing frame has a top opening disposedon the top side thereof and between the image sensing chip and themovable lens assembly, and the top opening of the housing frame isenclosed by the optical filter, wherein the movable lens assembly has abottom plane on the bottom side thereof for directly contacting thesecond horizontal top surface of the optical filter, and thepredetermined fixed focusing distance from the second horizontal topsurface of the optical filter to the first horizontal top surface of theimage sensing chip is substantially the same as an adjustable focusingdistance from the bottom plane of the movable lens assembly to the firsthorizontal top surface of the image sensing chip, wherein thesurrounding movable member has an inner surrounding surface as athreadless surface, and the movable lens assembly has an outer perimetersurface as a threadless surface.
 9. The method of claim 7, wherein thelaser light source is disposed at a predetermined position above theimage sensing chip to generate a first laser light beam that is directlyprojected onto the first horizontal top surface of the image sensingchip, and the first laser light beam generated by the laser light sourceis reflected by the first horizontal top surface of the image sensingchip to form a first reflecting light beam that is directly projectedonto the predetermined position or very close to the predeterminedposition.
 10. The method of claim 7, wherein the laser light source isdisposed at a predetermined position above the optical filter togenerate a second laser light beam that is directly projected onto thesecond horizontal top surface of the optical filter, and the secondlaser light beam generated by the laser light source is reflected by thesecond horizontal top surface of the optical filter to form a secondreflecting light beam that is directly projected onto the predeterminedposition or very close to the predetermined position.